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Monolithic integration of AlGaInP-based red and InGaN-based green LEDs via adhesive bonding for multicolor emission | Scientific Reports
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Strategy toward the fabrication of ultrahigh-resolution micro-LED displays by bonding-interface-engineered vertical stacking and surface passivation - Nanoscale (RSC Publishing) DOI:10.1039/C9NR04423J
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New Technology Combining Adhesive Tapes and Laser Lift-off to Achieve High Yield Micro LED Transfer - LEDinside
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SDK Launches GaN-based Near Ultraviolet and Green LED Chips | News Releases | SHOWA DENKO K.K.
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